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OpenUnited Kingdom

Supply, Delivery and Installation Sinter Bonding Capability

Key facts

Country
United Kingdom
Region
UKM82
Estimated value
not stated
Published
Source
UK Find a Tender

Description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided…

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