OpenUnited Kingdom
Sub-Micron Die Bonder
Key facts
- Country
- United Kingdom
- Region
- UKE32
- Estimated value
- not stated
- Published
- Source
- UK Find a Tender
Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
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